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  • 工藝制程能力

    制程
    Process
    項目
    Item
    通常
    Normal Capability
    改進
    Advanced capability
    內層         Inner layer
    內層線路
     Inner layer exposure
    最小板厚(不含銅)
    Min. board thickness (without Cu)
    0.075mm 0.05mm
    對位公差
    Registration tolerance
    +/-2mil +/-1.5mil
    內層銅厚
    Inner copper thickness
    2OZ 3OZ
    線寬/線距
    wire width/space
    4/4mil 3/3mil
    內層孔到線間距
     Inner layer hole to wire
    4
    4L
    7mil 6mil
    6
    6L
    8mil 7mil
    8
    8L
    9mil 8mil
    10層及以上
    10L& above
    10mil 9mil
    壓合
    Lamination
    最大層數
    Max layer count
    10L 12L
    層間對準度
    Layer to lay registration
    +/-4mil +/-3mil
    銅箔厚度
    Copper foil thickness
    0.5OZ~3OZ 1/3OZ-3oz
    介電層厚度公差
    Dielectric layer thickness tolerance
    ±10% ±8%
    鉆孔
    Drilling
    最大鉆孔孔徑
    Max. drilling size
    6.0mm 6.5mm
    最小鉆孔孔徑
    Min drilling size
    0.25mm 0.2mm
    孔位精度公差
    Drilling hole tolerance
    +/-3mil +/-2mil
    NPTH 孔徑公差
    NPTH hole size tolerance
    +0/-0.05mm +0/-0.025mm
    PTH 孔徑公差(完成)
    PTH hole size tolerance (finished)
    +/-3mil +/-2mil
    孔壁粗糙度
    Hole roughness
    25μm 20μm
    沉銅電鍍
    PTH
    生產孔徑(最小)
    Hole size (Min)
    0.25mm 0.2mm
    縱橫比(最大)
    Aspect ratio(Max)
    8:1 101
    線路
    Image transfer
    外層最大銅厚
    Max. Cu thickness
    3OZ 4OZ
    干膜最大封孔能力
    Dry film tenting
    4.5mm 6.0mm
    對位公差
    registration tolerance
    +/-2mil +/-1.5mil
    線寬/線距 (底銅0.5OZ)
    Wire Width/Space (base Cu 0.5OZ)
    4/4mil (底銅0.5OZ) 3/3mil
    阻焊
    Solder mask
    綠油橋最小寬度
    Min. Solder bar 
    4mil 3mil
    綠油厚度
    Soler mask thickness
    線角≧7μm,(line corner)
    線面≧10μm (line surface)
    線角≧7μm,(line corner)
    線面≧10μm (line surface)
    對位公差
    Registration tolerance
    +/-2mil +/-1.5mil
    塞孔最大孔徑
     Hole plugging size
    0.45mm 0.55mm
    SMT PAD之間最小距離
     Min. PAD space
    7mil 6mil
    字符
    Legend
    最小線寬線距
    Min. line width/space
    4mil/4mil 3.5mil/3.5mil
    白字最小內徑
    Inner diameter of digital
    8mil 7mil
    碳油
    Carbon ink
    碳油方阻
     Rectangular resistance
    40ohm 30ohm
    印油PAD最小間距
    Min carbon ink space
    30mil 25mil
    成型
    Routing
    鑼板尺寸公差
    Routing tolerance
    +/-4mil +/-3mil
    最小鑼刀
    Min routing bit
    0.8mm 0.7mm
    槽位到鑼邊距離
    routing slot to side
    10mil(0.25mm) 8mil(0.2mm)
    啤板
    Punching
    啤板尺寸公差
    Punching tolerance
    +/-4mil +/-3mil
    孔到邊精度
    hole to side
    ±5mil (0.125mm) ±4mil (0.1mm)
    V-CUT
    上、下V坑線對準度
    Leveling of top/bottom V-cut line
    ±4mil (0.1mm) ± 3mil (0.075mm)
    余厚控制精度
     web thickness
    ±4mil (0.1mm) ± 3mil (0.075mm)
    V坑位置公差
    V-Cut position
    ±4mil (0.1mm) ± 3mil (0.075mm)
    電測試
    E-testing
    測試最小PAD
    Min testing PAD
    10mil 8mil
    表面處理
    Surface finish
    OSP厚度
    OSP film thickness
    0.2-0.5μm 0.25-0.5μm
    沉錫厚度
    Immersion Tin thickness
    0.8-1.2μm 1.0-1.2μm
    沉銀厚度
    Immersion Ag thickness
    0.1-0.3μm 0.2-0.3μm
    化金厚度
    Immersion Au thickness
    1-2.5μ 1-2.5μ
    沉鎳厚度
    Immersion Nick thickness
    120-250μ 160-250μ
    有鉛噴錫厚度
    HASL (Pb)
    1-40μm 2-40μm
    無鉛噴錫厚度
    HASL (Pb free)
    1-40μm 2-40μm
    其它能力
    Other
    阻抗控制
    Impedance tolerance
    ±10% ±8%
    板彎板曲
    Board warpage/twist
    0.75% 0.50%
    內外層線寬公差 ±20% ±15%
    外層最大板尺寸
    Max Board size
    610x450mm 630x510mm
    外層最小板尺寸
    Min. board size
    75*75mm 50*50mm
    外層最大板厚
    Max board thickness
    2.5mm 3.2mm
    外層最小板厚
    Min board thickness
    0.4mm 0.3mm

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